* Fuji Electronic Holdings Co Ltd. Patent number as follows:
Japan No. 3296289, U.S. No. 6179935B1, Germany No. 19816671C2 (add content of percentage of Ni and Ge)
Tin/Lead BGA Sphere
All of alloy composition to meet JIS-Z 3282E specification standards
A range of flux gel for BGA (Ball Grid Array) and rework applications. Also available for electrical, engineering and plumbing applications.
consistency flux, application specific for BGA (Ball Grid Array)
components but offering benefit in rework applications where
sufficient solder is already present on the component.
Spread thinly at approximately 3 µm thick it will effectively
flux any tinned surface without the problem of droplet volume
control with the added advantage of leaving a minimal non-corrosive
MOB 39: Supplied in syringes of 5cc, 10cc and 100g jars.
FLT 396: Adhesive Flux
Cascade Water Washable Flux Gel
Blu Gel: A general purpose flux gel.
Flux Gel suitable for soldering aluminium and aluminium alloys. Alugel TDS
Data Sheet for each product is available. Click on the PDF icon to
For small to medium orders,
payment can be made through PayPal.
Email MBO for details.