MBO Company Presentation:
**New Products**
MBO SIA Alloy and Solder Paste
This Tin and Bismuth alloy makes it possible to meet actual challenges by offering a lead-free alloy solution, controlled costs (no Silver in the alloy), thermal and mechanical properties comparable to SAC-type solutions and operating cost reductions (reduction of energy bills and limitation of dross formation).
MBO Orion 414 LF JP (Jet Printing)
ORION 414 LF JP no-clean solder paste has been developed in MBO laboratories. It is designed to offer a high level of activity by leaving low residues, non-corrosive. This product, suitable for JET PRINTING applications meets the international requirements of the electronics industry.
Orion 414 LF JP Jet Printing Solder Paste
MBO No-clean Solder Wire "ROB"
MBO "ROB" solder wire has been developed specifically for use with Automatic / Robotic / Robot Soldering Systems
MBO ROB Solder Wire for Robot Soldering Systems
Cascade Water Washable Flux Gel
CASCADE 1 water-soluble gel is carefully formulated to confer high activity soldering. Its residues can be easily removed with deionised water.
- Halide-free
- Water-washable residues
- High activity
- Very good tack-life = 16 hours
Cascade Water Washable Flux Gel
Sn95 Sb5 Lead Free
Sn95Sb5 - a new addition to our Lead Free product range.
Solidus 232C - Liquidus 240C.
The Sn95Sb5 alloy is available in Lead Free solder paste, solder bar and solder stick form.
Offering a little more in turn opening your reflow process operating window, particularly where a dual solder reflow process is employed.
Sn95Sb5 RSN 70 Solder Paste Reflow Guideline
Contact us for further details: info@mbouk.co.uk
Sirius 1 Lead Free
SIRIUS 1LF is a No-Clean & Lead Free solder paste.
Carefully formulated to solder all surfaces, SIRIUS 1LF leaves a very low volume of clear residues after soldering.
This paste is designed to offer a wide process window and reduces solder defects with a minimum increase of temperature compared to lead content products.
The flux system is long life, reduces paste waste and costs.
The residues are non-corrosive and completely benign. The solder paste meets the international test standards and recent directives about hazardous substances.
Tests and Qualifications include criteria from the J-STD-004, -005, and -006 specifications (IPC-TM-650 tests methods).
Sirius 1 Lead Free Joint Standards Qualification Report 1.27MB PDF Document
Sirius 1 VLMP - Low Melting Alloys
SIRIUS 1LF is a No-Clean & Lead Free solder paste.
Sirius 1 VLMP - Low Melting Allows